Description
Product Information
Features | Benefits |
---|---|
Plug-and-play operation with a built-in touch screen | User friendly and office friendly |
Few Moving Parts | Strong and reliable production system; quiet operation; user serviceable |
"Planerizing" each layer is not required, reducing material consumed by up to 30% | Lower part cost; shorter build times |
Large Build Volume (10" x 15" x 13") | Produce everything from concept models to functional parts |
Z Resolution of 50 - 100 microns (User Adjustable & Material Dependent) | High quality, small engineering and production components |
Parameter | Specification |
---|---|
Technology | 3SP (Scan, Spin, and Selectively Photocure) |
Light Source | Laser Diode |
Build Envelope | "254 x 362 x 330 mm 10 x 14.25 x 13 in." |
Z Resolution (User Adjustable & Material Dependent) | 50-100 microns |
Footprint | 163 x 140 x 183 cm 64 x 55 x 72 in. |
Electrical Requirements | 220 Volt, Single Phase, 15 Amps |
Materials Available | E-Glass 2.0, ABS Hi-Impact, E-Model, E-Rigid PU, FormCast Powered by Somos, E-RigidForm, E-Tool 2.0 |
Specifications subject to change without notice.