Description
Product Information
Features | Benefits |
---|---|
Plug-and-play operation with a built-in touch screen | User friendly and office friendly |
Few Moving Parts | Strong and reliable production system; quiet operation; user serviceable |
Support material is perforated and partially cured | Easily removable support material |
3SP (Spin, Scan, and Selectively Cure) Technology | Layerless technology with no stair-stepping on inner and outer surfaces |
"Planerizing" each layer is not required, reducing material consumed by up to 30% | Lower part cost; shorter build times |
Z Resolution of 50 - 100 microns (User Adjustable & Material Dependent) | High quality, small engineering and production components |
Parameter | Specification |
---|---|
Technology | 3SP (Scan, Spin, and Selectively Photocure) |
Light Source | Laser Diode |
Build Envelope | 266 x 177 x 193 mm 10.5 x 7 x 7.6 in. |
Z Resolution (User Adjustable & Material Dependent) | 50-100 microns |
Footprint | 74 x 76 x 117 cm 29 x 30 x 46 in. Stand 29 x 30 x 25 in. |
Electrical Requirements | 15 100-127 VAC, 50/60 Hz, single phase, 8A |
Materials Available | E-Glass 2.0, ABS Hi-Impact, E-Model, E-Rigid PU, FormCast Powered by Somos, E-RigidForm, E-Tool 2.0 |
Specifications subject to change without notice.