|Plug-and-play operation with a built-in touch screen||User friendly and office friendly|
|Few Moving Parts||Strong and reliable production system; quiet operation; user serviceable|
|Support material is perforated and partially cured||Easily removable support material|
|3SP (Spin, Scan, and Selectively Cure) Technology||Layerless technology with no stair-stepping on inner and outer surfaces|
|"Planerizing" each layer is not required, reducing material consumed by up to 30%||Lower part cost; shorter build times|
|Z Resolution of 50 - 100 microns (User Adjustable & Material Dependent)||High quality, small engineering and production components|
|Technology||3SP (Scan, Spin, and Selectively Photocure)|
|Light Source||Laser Diode|
|Build Envelope||266 x 177 x 193 mm
10.5 x 7 x 7.6 in.
|Z Resolution (User Adjustable & Material Dependent)||50-100 microns|
|Footprint||74 x 76 x 117 cm
29 x 30 x 46 in.
Stand 29 x 30 x 25 in.
|Electrical Requirements||15 100-127 VAC, 50/60 Hz, single phase, 8A|
|Materials Available||E-Glass 2.0, ABS Hi-Impact, E-Model, E-Rigid PU, FormCast Powered by Somos, E-RigidForm, E-Tool 2.0|
Specifications subject to change without notice.